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JUNE 24 - 27, 2019
The Westin Peachtree Plaza
Atlanta, Georgia
 #wipes17@wipescon

Conference Speakers

Untch

Joy Untch

Manager, Nonwovens And Construction Innovation Tech Services, OMNOVA Solutions, Inc.

BIOGRAPHY

Mrs. Untch serves as the Innovations Portfolio Leader for both the Nonwovens and Construction Materials markets overseeing NPD projects and applications engineers. She has been a Manager, Nonwovens and Construction Innovation Tech Services at OMNOVA Solutions since 2016. Holding a Bachelor of Science degree in Chemical Engineering from the University of Akron, she started her Research and Development career at Goodyear Chemical working with solution polymers.

In 2002, Joy joined OMNOVA as process engineer in the Mogadore, OH Pilot Plant and continued working in the Pilot Plant developing emulsion polymer products until 2012 when she moved to a role at the OMNOVA Global Technology Center (Akron) focused on new polymer applications and testing. Joy has received eight OMNOVA Technology Awards during her career for her contributions to new product development, commercialization, and innovation.

Outside of work, Joy and her husband Mike remain busy raising their 3 sons. She enjoys spending time in her kitchen “scaling up” recipes attempting to keep all the boys fed. 


Wednesday, June 26
10:30 am - 12:00 pm
Material Development in Wipes II

Innovative Technology Platform for Enhanced Functionality in Wipes

OMNOVA’s TRIBUTE technology platform, consisting of a unique finishing treatment and compatible specialized binders, will help create properties that enhance the wipes performance and deliver differentiated features in cost-effective and environmentally friendly ways. The list of possible enhancements through this technology platform include thinner, softer, more absorbent, durable, lint-free wipes as well as significant advantages in substitution of substrate components without impacting performance.

OMNOVA’s new wipes technology platform is a three-part solution that includes special Sunbond® and Acrygen® binders and the innovative SoftWick™ SF20 surface treatment. Sunbond improves dry / wet strength, imparts significant linting reduction / lint free substrates, and provides reduced quaternary absorption. Acrygen improves softness, hand/feel and significantly improves abrasion resistance. SoftWick SF20 imparts best in class wicking performance, excellent hydrophilicity, and significantly improves liquid absorption capacity, while adding softness. The technology platform is ideal for use on Polypropylene, Polyester, PLA, and multi-fiber component substrates, and it opens the door to substitution or rebalancing of substrate components.

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